Understand dip plug-in manufacturing process

SMT processing technology has developed rapidly in recent years, and SMT patch processing has gradually replaced Dip plug-in Type processing. However, due to the excessive size of some electronic components in PCBA production, plug-in processing has not been replaced and still plays an important role in the process of electronic assembly processing.Dip plug-in After SMT chip processing, manual plug-ins in the production line are generally used, which requires many employees.

Dip plug-in The general process flow of processing is: part forming → plug-in → wave crest welding → part cutting → repair welding (post welding) → plate washing → function test.

1. Pre machined parts. Firstly, the staff at the pre-processing site receive materials from the materials according to the BOM bill of materials, carefully check the model and specification of the materials, sign, carry out pre-processing before production according to the template, and process with forming equipment such as automatic bulk capacitor foot phone, electro crystal automatic forming machine and full-automatic belt forming machine.

2. The plug-in inserts the parts processed by the chip into the corresponding position of the PCB board to prepare for wave soldering.

3. Wave soldering: put the PCB board of the plug-in into the wave soldering conveyor belt, and complete the welding of PCB board through spraying flux, preheating, wave soldering, cooling and other links.

4. Cut off the feet of components and parts, and cut off the welded PCBA board to an appropriate size.

5. Repair welding (post welding), test the unwelded PCBA finished plate for repair welding.

6. Wash the plate and clean the flux and other harmful substances remaining on the finished PCBA products to meet the environmental standard cleanliness required by customers.

7. After functional test and component welding, the PCBA finished board shall be subject to functional test to test whether each function is normal. When functional defects are detected, maintenance and retesting shall be carried out.