What are the four types of IC packaging

Integrated circuit , also known as microcircuit, microchip and chip. It is a miniaturized circuit in electronics (mainly including semiconductor devices, passive components, etc.), which is usually manufactured on the surface of semiconductor wafer. Integrated circuit has the advantages of small volume, light weight, less outgoing lines and solder joints, long service life, high reliability and good performance. At the same time, it has low cost and is convenient for mass production. In many modern industries, integrated circuits have almost become indispensable.

the moment,Integrated circuit The industry no longer relies on the development of single devices such as CPU and memory. Mobile Internet, three networks integration, multi screen interaction and intelligent terminals bring multiple market spaces. Continuous innovation of business model injects new vitality into the market. China's integrated circuit industry has a certain foundation. Over the years, China's integrated circuit industry has concentrated its technological innovation vitality, market development ability, resource integration power and broad market potential, which has laid a foundation for the industry to achieve rapid development and enter a new stage in the next 5 to 10 years.

1. SOP small outline package.

SOP began in the late 1970s and is also called DFP and sol. In actual production, SOP is a commonly used component packaging form. In addition, SOP is one of surface mount packaging, which is mainly L-shaped in terms of packaging shape. In terms of packaging materials, SOP is mainly divided into plastic SOP and ceramic SOP.

SOP packaging can be used not only for memory LSI, but also for other fields. For example, the input and output terminals do not exceed 10-40. With the progress and demand of the times, SOP has gradually developed SSOP, SOIC and other packaging forms.

2. BGA ball grid array package.

After upgrading the PGA pin grid array, the BGA package can be obtained. The method of BGA package is to fill pins on a surface in a format, so electronic signals can be transmitted from integrated circuits to printed circuit boards. After BGA packaging, the pins at the bottom of the package can be replaced by other forms, usually manually or automatically configured with solder balls positioned with flux.

Compared with other packaging forms, such as four side pin flat packaging and dual in-line packaging, BGA packaging has two advantages: one is that it can accommodate more connectors, the other is that the average line length is shorter, and the other is that BGA packaging has faster performance.

3. PGA pin grid array package.

PGA pin grid array packaging is mainly used in the field of microprocessor. In this field, this packaging form can give full play to the maximum efficiency. PGA socket grid array packaging is mainly packaged in porcelain chips in the form of integrated circuits arranged at the bottom and square sockets, which can be simply connected through sockets Integrated circuit Welded to the socket of the circuit board. It can be seen that PGA pin grid array packaging is suitable for occasions with frequent plugging. Compared with the dual column direct insertion package, the advantage of PGA insertion grid array package is that it can complete the same work in a smaller area.

4. Dip dual in-line package.

Dip dual in-line packaging refers to the integrated circuit chips with dual in-line packaging. Most small and medium-sized integrated circuit ICs adopt this packaging form, and the number of pins generally does not exceed 100. The CPU chip with dip package has two rows of pins, which need to be inserted into the chip socket with dip structure. Please be careful not to damage the pin when the chip encapsulated in dip is pulled out of the chip socket.