Do you know what reliability testing items there are for electronic components?

1、 Physical performance test items.

1. Internal water vapor: determine the water vapor packaged in metal or ceramics Photoelectric device Water vapor content in internal gas.

2. Sealing performance: determine the air tightness of the inner cavity of optoelectronic devices.

3. ESD value: determine the sensitivity and sensitivity of photoelectric devices damaged and degraded due to electrostatic discharge.

4. Flammability: determine the flammability of materials used for photoelectric devices.

5. Shear force: determine the integrity of the material and process of the photoelectric device chip and passive device installed on the socket or other substrate.

6. Weldability: determine the to be welded Photoelectric device Solderability of conductor (conductor with diameter less than 30175 mm and flat conductor with equivalent cross-sectional area).

7. Wire bonding strength: determine the strength of low-temperature welding, hot pressing welding, ultrasonic welding and other technologies used in optoelectronic devices

2、 Mechanical integrity test items.

1. Mechanical impact: Determination Photoelectric device Whether it can be applied to electronic equipment requiring moderate severe impact. The impact may be caused by sudden stress or violent vibration during loading, unloading, transportation or on-site use.

2. Variable frequency vibration: determine the impact of vibration on various components of optoelectronic devices within the standard frequency range.

3. Thermal shock: Determination Photoelectric device Resistance and function in case of drastic temperature change.

4. Plug durability: determine whether the optical power, loss, reflection and other parameters of optical fiber connector of optoelectronic devices can meet the repeated requirements.

5. Storage test: determine Photoelectric device Whether it can be transported and stored under high and low temperature.

6. Temperature cycle: determine the ability of photoelectric devices to withstand extremely high temperature and extremely low temperature, including the impact of alternating changes of extremely high temperature and extremely low temperature on photoelectric devices.

7. Constant humidity heat: determine whether the sealed and unsealed photoelectric devices can withstand the specified temperature and humidity together.

8. High temperature life: determine the high temperature accelerated aging fault mechanism and working life of photoelectric devices.

3、 Accelerated aging test.

stay Photoelectric device Apply high temperature, high humidity and certain driving current to accelerate aging. According to the test results, judge the functions and lost functions of the photoelectric device, including receiving and rejecting, adjust the working conditions of the photoelectric device and calculate the reliability.

1. High temperature accelerated aging: the most basic environmental stress in the accelerated aging process is high temperature. During the experiment, the selected parameters shall be monitored regularly until the degradation exceeds the service life.

2. Constant temperature test: the constant temperature test is similar to the high temperature operation test. The number of constant temperature test samples and the number of allowable failures shall be specified.

3. Variable temperature test: the variable temperature and high temperature accelerated aging test is to gradually raise the temperature on schedule (such as 60 ℃, 85 ℃ and 100 ℃)

4. Temperature cycle: in addition to environmental stress test, photoelectric devices also need temperature cycle, which can accelerate the aging of pipeline electronic devices. The purpose of accelerating the temperature cycle is generally not to cause the degradation of specific performance parameters, but to provide an additional description of the long-term mechanical stability of the optical path in the component.