Difference between positive and negative PCB

The effect of PCB positive and negative process is just the opposite.

Positive film process generally has no copper, and negative film process has copper by default.

In terms of presentation effect, copper is reserved in the positive process wiring and copper laying place, and there is no copper reservation in the place without wiring and copper laying; There is no copper reservation in the negative process wiring and copper laying place, and there is copper reservation in the place without wiring and copper laying.

In short, positive film technology is to have what you see on the negative film, while negative film technology is the opposite. What you see is nothing.

Differences between PCB positive and negative output processes:

Positive film is generally what we call pattern process, and the solution used is alkaline etching. From the negative, the required line and copper surface are black or brown, not transparent.

Negatives are generally what we call the tenting process, and the solution used is acid etching. From the negative film, the line and copper surface required by the negative film are transparent, and the line not required is black or brown.

Advantages of positive film: DRC inspection is perfect, but the disadvantage is that if the parts are to be moved or perforated, the copper foil needs to be laid or connected again, otherwise there will be short circuit or open circuit.

The negative film just overcomes the disadvantage that the positive film moves or the perforated copper foil needs to be replayed or reconnected.

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